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PECVD Plasma Chemical Vapor Deposition System
It is mainly used to deposit AlxOy, SiO2/SiOxNy and SixNy films on silicon wafers in the manufacture of crystalline silicon solar cells.
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Product description
purpose
It is mainly used to deposit AlxOy, SiO2/SiOxNy and SixNy films on silicon wafers in the manufacture of crystalline silicon solar cells.
Technical advantages
The process is flexible and can realize multi-layer composite film.
The unique cantilever push-pull boat reduces the time of entering and exiting the boat, shortens the total process time, improves the productivity of the equipment, and improves the efficiency of the equipment.
The super long constant temperature zone, 6-point temperature control and unique heater in the furnace, together with the intelligent cascade temperature control system to independently and accurately control the furnace body temperature, are powerful guarantees for furnace temperature uniformity and stability.
A special filter is added at the front end of the vacuum pump to reduce the jamming rate of the vacuum pump, improve the service life of the vacuum pump and improve the equipment efficiency.
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