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LPCVD Low Pressure Chemical Vapor Deposition Equipment
LPCVD is to deposit a stable solid film with atmospheric compounds'reaction on substrate surface underlowpressure and heating,As the average free travel and diffusion coeficient of gases particles are high due toloworking pressure, productivity can be enhanced by compact substrateloading thus to obtain high unifo-rmityfilm.
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Product description
LPCVD is to deposit a stable solid film with atmospheric compounds'reaction on substrate surface underlowpressure and heating,As the average free travel and diffusion coeficient of gases particles are high due toloworking pressure, productivity can be enhanced by compact substrateloading thus to obtain high unifo-rmityfilm.
LPCVD is used to deposit multiple films ofPoly-Si, Si3N4.Si02,phosphor silicate glass,boronphosphor silicateglass,n-poly and refractory metaletc.LPCVD is silicate glass,n-poly and refractory metaletc.LPCVD iswidelyappliedin manufacturing processes ofsemicon-ductorlCs,electrics & electronics,photoelectron and MEM Sindustry
Featuresofequipments
With automatically control of processing time,temperaturegas flow.valves,reaction chamber pressure.
With imported pressure controlsystemclosed-loopstability.
With stainless steel pipe,valves,guarantee the hermetic of gas system.
With alarm and interlock function.
With reasonable HMI/PC and flexible processing function.
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