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PEVCD Plasma Enhanced Chemical Vapor Deposition

PECVD mainly used for thin-film deposition of Poly-Si, SisN4, SiO2, amorphous silicon and refractory metailicide etc.Now is widely used in semiconductor intearated circuits. electricity. electronics. optoelectronicsand MEMS industries.

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PECVD mainly used for thin-film deposition of Poly-Si, SisN4, SiO2, amorphous silicon and refractory metailicide etc.Now is widely used in semiconductor intearated circuits. electricity. electronics. optoelectronicsand MEMS industries.

 Featuresofequipments

◆With automatically control of processing time.temperaturgas flow,valves,reaction chamber pressure
◆With imported pressure controlsystem,closedloop,stability
◆With stainless steel pipe.valvesquarantee the hermetic of gas system.
◆With alarm and interlock function
◆With reasonable HMI/PC and flexible processing functior.

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