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Vacuum Welding Furnace

The vacuum welding furnace is a new type of equipment that performs void-free welding under vacuum conditions, making it suitable for large-scale production. After using this equipment, the area affected by voids in the welded region can be reduced to as low as 2%, whereas conventional reflow soldering typically results in void formation over about 20% of the soldered area. The gases allowed for use include nitrogen, hydrogen, and nitrogen-hydrogen mixtures. Additionally, this equipment supports trace amounts of flux and enables void-free soldering processes with minimal void formation. The equipment can optionally employ HCOOH chemical activation to achieve even higher cleanliness requirements in soldering processes; moreover, it can even use lead-free solder pastes or soldering sheets without the need for additional flux. The control system features an industrial PC and PLC as the main control units, with temperature-control modules serving as the temperature-regulation execution units. It utilizes a touch-screen industrial display as the human-machine interface, equipped with comprehensive alarm functions to ensure that the entire process remains stable and controllable.

Product description

Main uses

The vacuum welding furnace is a new type of equipment that performs void-free welding under vacuum conditions, making it suitable for large-scale production. After using this equipment, the area affected by voids in the welded region can be reduced to as low as 2%, whereas conventional reflow soldering typically results in void coverage of around 20%. The gases allowed for use include nitrogen, hydrogen, and nitrogen-hydrogen mixtures. Additionally, this equipment supports trace amounts of flux and enables void-free soldering processes with minimal void formation. The equipment can optionally employ HCOOH chemical activation to achieve even higher cleanliness standards in soldering processes; moreover, it can even work with lead-free solder pastes or soldering sheets without the need for additional flux. The control system features an industrial PC and PLC as the main control units, with temperature-control modules serving as the temperature-control execution units. It uses a touch-screen industrial display as the human-machine interface, equipped with comprehensive alarm functions to ensure the entire process remains stable and controllable.

Main Technical Data

The process temperature can reach up to 450℃. At full load, the surface temperature of the heating plate is measured with an accuracy of ±2℃, and the product temperature inside the container is measured with an accuracy of ±5℃.
In the no-load vacuum reflux chamber, the dynamic profile heating rate is ≥7℃/s, and the ramp-up rate is ≥10℃/s.
The working chamber can achieve a vacuum level as low as 10 Pa and can be customized according to user requirements, with the maximum achievable vacuum level being 10. -4 Pa's vacuum level
The vacuum reflux process area features multi-layer heating plates, each of which can accommodate workpieces up to 100 mm in height, with a maximum load capacity of 18 kg.

Main advantages

The working chamber is equipped with multiple layers of heating plates that integrate both heating and cooling functions. The temperature of each heating plate can be controlled independently, enabling the implementation of various processing techniques.
The outer edge of the heating plate features a compensating heating function, ensuring excellent temperature uniformity across the plate. When fully loaded, the surface temperature measurement accuracy of the heating plate is ±2℃.
The product temperature accuracy inside the container is ±5℃.
After using this device, the area of the solder joint affected by voids can be reduced to as little as 2%, whereas the typical reflow soldering process results in a void rate of around 20%.
The equipment’s process operation is stable, uniform, and reliable; its functions—including the temperature control system, gas control system, alarm system, and emergency response system—are fully equipped.

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