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Vacuum Sintering Furnace for Semiconductors
The new-generation tubular vacuum sintering furnace is primarily used for the sintering processes of semiconductor components and power rectifier devices. It can perform vacuum sintering, gas-protected sintering, and conventional sintering. As a novel piece of process equipment in the series of semiconductor-specific machinery, it features innovative design concepts, convenient operation, and a compact structure. This single unit can complete multiple process steps, and it can also be applied to other fields such as vacuum heat treatment and vacuum brazing. The equipment is available in single-station, dual-station, and multi-station configurations.
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Vacuum Sintering Furnace
The new-generation tubular vacuum sintering furnace is primarily used for the sintering processes of semiconductor components and power rectifier devices. It can perform vacuum sintering, gas-protected sintering, and conventional sintering. As a novel piece of process equipment in the series of semiconductor-specific machinery, it features innovative design concepts, convenient operation, and a compact structure. This single unit can complete multiple process steps, and it can also be applied to other fields such as vacuum heat treatment and vacuum brazing. The equipment is available in single-station, dual-station, and multi-station configurations.
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Address：Factory No.11, 9 Huanpu Road, Xinwu District, Wuxi City, Jiangsu Province
Tel：+86-510-85300509
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