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Diffusion furnace / Oxidation furnace
Diffusion furnace/oxidation furnace is one of the important process equipment in the pre‑process of semiconductor production line, which is used for diffusion, oxidation, annealing, alloying and sintering processes in large‑scale integrated circuits, discrete devices, power electronics, photoelectric devices and optical fiber industries.
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Product description
Diffusion furnace/oxidation furnace is one of the important process equipment in the pre‑process of semiconductor production line, which is used for diffusion, oxidation, annealing, alloying and sintering processes in large‑scale integrated circuits, discrete devices, power electronics, photoelectric devices and optical fiber industries. The design of the horizontal tube furnace takes into account the various process performance requirements of silicon wafer production, and has the maximum production capacity and superior performance indicators.
Process
- Dry oxygen oxidation, wet oxygen oxidation, DCE oxidation, nitrogen oxide silicon oxidation, etc.
Product Features
- High precision temperature control, multi‑point temperature control, uniform temperature
- Automatic control of temperature, gas flow, valve action, etc
- Adopting imported corrosion‑resistant stainless steel pipe fittings and valves to ensure gas flow airtightness
- Complete alarm function and safety interlock device
Main technical parameters
- Applicable silicon wafer size: 2‑8 inches
- Quantity of process tubes available: 1‑5 tubes/set
- Working temperature range: 500℃‑1250℃
- Constant temperature zone length: can be determined based on the loading amount
- Flow accuracy meets: ± 0.5% F.S
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