Diffusion furnace is a kind of heat processing equioment for wafers treatment such as diffusion,oxidiza-tion,anneal,alloy and sinterin which are using in semiconductor,discrete devices,photoelectronic,power electronic,solar battery and large scale integrated circuits and soon.lt is suitable for the wafer of 2~8 inch.
Atomic laver deposition system can produce high guality thin-film. by using our advanced equipment which is more steady and reliable. Application example:High-K gate oxide, storage capacitive dielectrics,medium to high aspect ratio diffusion barriers for copper interconnects, 0LED pinhole-less passivation layers, high uniform WEWS coatings,Nano porous structure coatings, spectialty fiber doping, solar cells,flat panel display,optica film,several kinds ofother specialstructure Nano-film.
PECVD mainly used for thin-film deposition of Poly-Si, SisN4, SiO2, amorphous silicon and refractory metailicide etc.Now is widely used in semiconductor intearated circuits. electricity. electronics. optoelectronicsand MEMS industries.
◆Quantity of process tube:1~5 tubes/set ◆Working temperature range:200~1000C ◆Length & precision ofconstanttemp.zonc300~1200mm 800~1000C+0.5C ◆Single pointtemperature stability: 800~1000C+0.5C124h ◆Max speed oftemp.increase: 15C/min ◆Max speed of temp.decrease: 15C/min